PCB, or printed circuit board, is a vital component in the electronics industry. Virtually every electronic device, from small ones like watches and calculators to large ones such as computers, communication equipment, and weapon systems, requires a PCB for electrical interconnections among integrated circuits and other electronic components. It consists of an insulating base, connecting wires, and pads for mounting and soldering electronic components, serving both as conductive paths and insulating substrates. PCBs can replace complex wiring, facilitating electrical connections between components, simplifying assembly and soldering, reducing labor, and easing workers' strain. They also reduce the overall size of the product, lower costs, and enhance the quality and reliability of electronic devices. With excellent product consistency, PCBs can be designed to standardize, promoting mechanization and automation in production. Moreover, assembled and debugged PCBs can serve as independent spare parts, facilitating product interchangeability and maintenance. PCBs are now widely used in the manufacturing of electronic products.
Printed circuit boards (PCBs) were initially based on paper substrates with copper foil. Since the emergence of semiconductor transistors in the 1950s, the demand for PCBs has surged. Particularly with the rapid development and widespread use of integrated circuits, electronic devices have become increasingly compact, with higher circuit routing density and complexity, necessitating continuous PCB advancements. Today, PCB types have evolved from single-sided to double-sided, multi-layer, and flexible boards; their structures and quality have reached ultra-high density, miniaturization, and high reliability levels; and new design methods, materials, and manufacturing processes are constantly emerging. In recent years, various computer-aided design (CAD) software applications for PCBs have become widespread in the industry, and in specialized PCB manufacturers, mechanized and automated production has completely replaced manual operations.
Processing Capability:
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| Sample | Bulk | |
Number of Layers | 2-44L | 2-58L |
Sheet thickness | 0.5-17.5mm | 0.6-10mm |
Smallest mechanical bore diameter | 0.1mm | 02mm |
3mil | 4mil | |
HDI Type | l+n+l、 2+n+2、3+n+3 | 1+n+l、 2+n+2 |
zuiFine line width & spacing | 3/3mil | 4/4mil |
Impedance Control | +/-5% | +/-10% |
zuiLarge thick copper | 12oz | 6oz |
zuiLarge plate, thick hole diameter ratio | 18:1 | 16:1 |
zuiLarge board dimensions | 650mm X 1130mm | 610mm X 1100mm |
Sheet material | FR4/Hi-Tg/Rogers/Halogen-Free/Rcc/PTFE/Nelco/Mixed Pressing Material | |
Surface Treatment | HASL HASL PB FREE | |
| Special Processing | B埋 blind holes, step grooves, metal substrates, embedded resistors, embedded capacitors, mixed pressure, soft-hard combination, back drilling, etc. | |




