This utility model relates to the field of modular power supplies, specifically concerning a pin device for a modular power supply.

Background Technology: The power module pin device is a power supply that can be directly mounted on a printed circuit board. It is characterized by providing power supply for integrated circuits (ASIC), digital signal processors (DSP), microprocessors, memory, field-programmable gate arrays (FPGA), and other digital or analog loads. With technological advancements, power modules are evolving towards being lightweight, compact, thin, low-noise, high-density, high-reliability, and anti-interference.

Miniature SMT-mounted power modules, with low output voltage, are widely used in communication, transmission, access, and router equipment. They are commonly applied to provide high-current DC (Direct Coupled, abbreviated as DC) power for core components such as CPUs and FPGAs on a single board. These modules are predominantly encapsulated using SMT surface-mount technology and are directly mounted onto the board during production.

For the pin of the power module, the surface mount technology (SMT) typically employs a straightening fixture for production to ensure the pins are vertical. However, conventional straightening fixtures are integrally machined, resulting in certain machining errors in the drilling depth that cannot be measured, and thus cannot guarantee consistency in the depth of multiple holes. The module power uses blind hole design. When the solder paste is vaporized in a high-temperature molten state, which is a known fact, the gas expands, blowing up the pins, causing the module's pins to be uneven. This leads to 40% of the power module products having poor pin coplanarity, resulting in a low overall product yield rate. There are many instances of false soldering during the SMT assembly of the module on a single board. Figure 1 shows a cross-sectional view of the old-style fixture for a single board drilling depth pin straightening device in the related technology of this utility model, with 101 being the straightening device, and 101a depicting the hole depth cross-section, which cannot achieve consistency in all hole depths due to machining factors. Figure 2 is a product image of the old design scheme in the related technology of this utility model, with 201 being the product, and 201a illustrating the pin diagram of the product produced by the old-style fixture (scheme in the related technology). The solder paste is vaporized in a high-temperature molten state, the gas expands, blowing up the pins, and reaching the upper limit of hole depth, causing the module's pins to be uneven.