What are the differences in the mechanisms and characteristics of grinding and polishing processes?_News Center Co., Ltd._Dongguan Ruijiete Precision Mold Co., Ltd. 
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Home > News Center Co., Ltd. > What are the differences in the mechanisms and characteristics of grinding and polishing processes?
News Center Co., Ltd.
What are the differences in the mechanisms and characteristics of grinding and polishing processes?
Publish Time:2023-05-09        View Count:55        Return to List

Polishing is a concept often associated with abrasion. It refers to the process of achieving a smooth surface by using a polishing disc made of high-speed rotating low-elastic materials (cotton fabric, felt, leatherette, etc.) or a polishing disc made of low-speed rotating soft elastic or viscoelastic materials (plastic, asphalt, paraffin, tin, etc.), along with a polishing agent, which possesses certain abrasive properties.

In summary, apart from the selection of abrasive and tool material, there is no fundamental difference between grinding and polishing. Polishing generally does not improve the shape and size accuracy of workpieces. It typically uses ultra-fine abrasive particles below 1μm, and polishing disks are commonly made from asphalt, paraffin, synthetic resin, artificial leather, and soft metals or non-metal materials like tin. The abrasive's force on the workpiece is minimal, preventing cracking. People conventionally refer to the machining method using hard tooling as grinding and the method using soft tooling as polishing. However, in the field of ultra-precision machining, there is no distinction between ultra-precision grinding and ultra-precision polishing.

Grinding processing boasts unparalleled advantages over other machining techniques: it is a typical "direct creative processing" or "evolutionary processing"; that is, by implementing precision-enhancing measures on the machine tool (such as micro feed, low grinding speed, and continuously changing the direction of the grinding movement), it directly produces parts with higher precision than the machine tool itself. This is because when the abrasive tool comes into contact with the workpiece, the modeling and simulation of non-ultra-precision plane grinding scratches are mandatory, leading to...

Under pressure, the process automatically selects local protrusions for machining, thereby only removing the excess material from both, allowing the研具 and workpiece to mutually correct and gradually enhance precision. The processing accuracy of ultra-precision lapping is almost unrelated to the precision of the machine tool's relative motion, mainly determined by the contact properties and pressure characteristics between the workpiece and the lapping tool, as well as the shape of the relative motion trajectory.

Additionally, the grinding process is highly adaptable, capable of processing various solid materials such as metals, semiconductor materials, glass materials, and more. It can handle common shapes like flats, holes, outer rounds, and silicon wafer substrates. Ultra-precision grinding is a pursuit of both cutting and grinding efficiency, while also offering processing precision and quality that cannot be achieved through standard cutting or grinding methods. The grinding process boasts features suitable for mass production, simple equipment, ease of operation, and high precision.


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