What are the different types of thick film hybrid integrated circuits?_News Center Co., Ltd._Dongguan Yezhiqiu Minxin Technology Co., Ltd.
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Home > News Center Co., Ltd. > What are the different types of thick film hybrid integrated circuits?
News Center Co., Ltd.
What are the different types of thick film hybrid integrated circuits?
Publish Time:2025-05-19        View Count:15        Return to List

Category by Function

Amplifiers: such as thick film hybrid integrated amplifiers, used for signal amplification.

2. Converter category: Includes Analog-to-Digital Converters (ADCs) and Digital-to-Analog Converters (DACs).

Filtering Products: Used for filtering in signal processing.

4. Power Category: Including DC/DC converters and PWM amplifiers, used for power conversion and amplification.

Two: Categorized by Substrate Material

Alumina Ceramic Substrate: Commonly uses 96% alumina ceramic, offering excellent electrical properties and mechanical strength.

2. Beryllium Oxide Ceramic Substrate: Used for applications requiring high thermal conductivity.

3. Other Substrates: Such as glass substrates, used for specific application scenarios.

III: Categorized by Component Type

Thick Film Resistor Networks: Integrated with multiple resistors for voltage division, current detection, and more.

2. Capacitive Network Thick Film Circuits: Integrated capacitors for filtering, coupling, and more.

3. Hybrid Component Thick Film Circuits: Integrating resistors, capacitors, and conductors to form complex circuits.

Four: Categorized by Manufacturing Process

Standard Thick Film Process: Utilizes screen printing and sintering techniques, suitable for most thick film circuits.

2. Multi-Layer Wiring Thick Film Technology: Enhances circuit density through multi-layer wiring, enabling complex functionalities.

3. Laser Tuning Thick Film Process: Utilizing laser to finely adjust resistance values, enhancing precision.

Category by Application Field

Automotive Electronics: such as engine control systems, electronic spark plugs.

2. Communication Equipment: such as power amplifiers, filters.

3. Aerospace: Aircraft communication systems, radar systems.

4. Home Appliances: such as switch power supplies, audio amplifiers.

Thick Film Hybrid Integrated Circuits feature flexible design, simple manufacturing processes, low cost, and are suitable for producing a variety of small to medium batches. They also exhibit excellent electrical properties, withstanding high voltages, large currents, and high power. The manufacturing process includes substrate preparation, paste preparation, screen printing, sintering, and testing. Their applications are extensive, covering automotive electronics, communication equipment, aerospace, household appliances, and more.

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