Usage and Maintenance of Burn-in Seats_News Center Co., Ltd._Shenzhen Zhiwei Chuang Electronic Technology Co., Ltd. 
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Home > News Center Co., Ltd. > Usage and Maintenance of Burn-in Seats
News Center Co., Ltd.
Usage and Maintenance of Burn-in Seats
Publish Time:2024-06-26        View Count:101        Return to List

Usage of Burn-in Seats

Properly position the burn-in socket on the burner.

B. Gently press/open the recording socket with your left hand while squeezing the suction pen with your right to吸取IC.

Please ensure even pressure is applied to both sides when pressing the recording seat, and it should be pressed vertically or horizontally along the socket's direction. Avoid pressing diagonally, as this may damage the recording seat.

C. Suck the IC properly, place the IC horizontally into the soldering socket. When the IC is 1-2mm above the needle in the socket, squeeze the suction pen to release the IC, allowing it to fall freely into the socket. Do not directly press the IC into the socket and then forcibly remove the pen. If you feel the IC is not securely placed, gently nudge the IC with the pen or pick it up again.

After placing the IC correctly, gently release your hand, allowing the clamping mechanism on both sides of the socket to securely press down on the IC.

Note: When releasing, ensure the pressure roller is evenly pressing on the IC. Gently let go; otherwise, it may cause unstable IC bonding and breakage of the recording pin.

Use Instructions

For different IC packaging parameters, it is mandatory to use a matching IC burning socket.

Do not force the IC into place if it cannot be inserted.

Check the recording socket before use:

1. The contact metal shrapnel for ICs is gold-plated, with a golden color. If it turns black or the color is uneven, it indicates oxidation of the metal shrapnel. Stop using it immediately, clean the burn-in socket, or replace it with a new one.

If the metal shim is broken or misaligned, or the socket is damaged, a new recording socket must be replaced.

Please gently press the burn-in pad and gently place the IC during use. Do not apply excessive force when picking up or placing the IC to avoid damaging the IC or the burn-in pad.

For BGA packaging, especially ball grid array (BGA) sockets, release the IC 1 to 2mm above the soldering pad, allowing it to fall freely into the pad. Do not directly press the IC into the socket.

Maintenance Matters

After each use of the burning station, clean the station to maintain a clean and污-free surface.

◆ Do not use corrosive cleaning agents as they may provide temporary results but cause severe damage, shortening the lifespan. Only use static brushes and precision cleaners for cleaning the metal spring of the recording seat. Do not use alcohol or lubricants to clean surface dirt.

Please store the cleaned recording stations in a moisture-proof box or a dry storage case.

◆ When not in use for an extended period, please close the lid and store the burner in its box. Opt for a sealed, dry, and cool place to prevent oxidation caused by storage conditions. Before reuse, inspect the burner surface for any dirt or oxidation (appearing black), and clean it with a fine cleaner before use.

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