On one hand, internal circuit oxidation and corrosion lead to short circuits. On the other hand, the high temperatures during the assembly and welding of electronic components cause moist gases inside the IC to expand, generating sufficient pressure that results in separation (delamination), wire bonding damage, chip damage, and internal cracks. More severe cracks can extend to the surface of the components, causing them to bulge and burst. Statistics show that more than a quarter of the defective and scrapped products in the global electronics and other industrial manufacturing sectors each year are caused by moist air.

Finished electronic components are also susceptible to moisture damage during storage. The humidity for the production and storage environment of electronic industrial products should be below 40%. Some types of electronic components require even lower humidity. Therefore, desiccants are indispensable in the packaging of electronic components. Montmorillonite desiccant is an excellent helper in preventing moisture for electronic products, with a higher moisture absorption rate in low humidity environments, offering better protection for your electronic devices.