With our experience in semiconductor chip cleaning, we need to improve more. To make greater breakthroughs in precision cleaning,

We have successfully completed the design, manufacturing, and testing of the new JP-5 component. The explosive effect is excellent and it is applied in microchip cleaning. The particle diameter is very small, ranging from 1 to 10 micrometers. The spray is uniform with no pulsation, the surface is soft, and it is easy to clean. We expect this development to significantly improve the cleaning results for EMES chips.

The newly installed component is the DosingUnitDO-M, not the AC-S. This further enhances the precision for the configuration in the semiconductor chip cleaning industry.