Cleanroom temperature and humidity are primarily determined by process requirements, but under the condition of meeting these requirements, human comfort should also be considered. With the increasing air cleanliness requirements, there is a trend that the process demands stricter temperature and humidity control. Specific process requirements for temperature will be listed later, but as a general principle, due to the increasing precision of processing, the required temperature fluctuation range is becoming smaller. For example, in the photolithography exposure process for large-scale integrated circuit production, the difference in thermal expansion coefficient between the glass used as the mask material and the silicon wafer is required to be smaller. For a 100 um diameter silicon wafer, a temperature rise of 1 degree causes a linear expansion of 0.24 um, thus requiring a ±0.1 degree constant temperature. Additionally, humidity levels are generally lower to prevent contamination, especially in semiconductor workshops that are sensitive to sodium. Such workshops should not exceed 25 degrees Celsius in temperature, as higher humidity can cause more issues. When the relative humidity exceeds 55%, condensation can form on the walls of the cooling water pipes, which can lead to various accidents if it occurs in precision equipment or circuits. At 50% relative humidity, rusting is more likely to occur. Moreover, when humidity is too high, dust attached to the silicon wafer surface can be adhered by water molecules in the air.Chemical AdsorptionSurface cleaning is challenging. The higher the relative humidity, the harder it is to remove the adhesive. However, when the relative humidity falls below 30%, particles are easily attracted to the surface due to static electricity, and a large number of semiconductor devices are prone to breakdown. For wafer production, the humidity range is 35-45%.