Direct Electroplated Metalized Substrate (DPC)
DPC (Direct Plating Copper) is a fundamental electronic material that achieves metallization on ceramic surfaces through magnetic sputtering pre-plating, based on electroplating technology, and facilitates thermoelectric separation.
Advantages
1. Higher thermal conductivity, a more matched coefficient of thermal expansion.
2. Stronger, lower resistance metal film layer.
3. Excellent weldability and high operating temperature.
4. Excellent insulation properties.
5. Customizable conductive layer thickness within the range of lum to 1mm.
6. Non-organic content, resistant to cosmic radiation, high reliability in aerospace applications, and long service life.
7. High-density assembly line/spacing (L/S) resolution up to 20um, enabling integrated miniaturization of equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Copper-plated sealed holes, high reliability.
10. 3D Substrate, 3D Wiring.
Application Fields: Automotive Electronics, Industrial Control Electronics, Communication Industry, LED Packaging, Gesture Recognition, Face Recognition, TEC Refrigeration, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LEDs, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Cameras, Vehicle LED, UV LED
Technical Capabilities
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Copper-clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material made by directly sintering copper foil onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulation properties.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycle performance with up to 50,000 cycles, ensuring high reliability.
5. Structures that can be etched with various patterns, just like PCB boards (or IMS substrates).
6. Non-polluting and free from hazards.
7. Operating temperature range wide -55℃ to 850℃; thermal expansion coefficient close to silicon, simplifying the production process of power modules.
Application Fields: The application of DBC ceramic substrates is extensive in downstream industries, including semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, and intelligent power components, as well as high-frequency applications.
DBC ceramic substrates are featured in a variety of industrial electronics fields, including switch power supplies, solid-state relays, automotive electronics, solar panel components, telecommunication dedicated switches, receiving systems, and lasers.
Technical Capabilities
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Copper-clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes the reactive metal elements in the solder (such as Ti/Ag/Zr/Cu) to bond ceramics with metals, forming a reaction layer on the ceramic that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between the ceramic and reactive metal solder paste at high temperatures, resulting in higher bonding strength and better reliability, making them suitable for connectors or applications with high current carrying capacity and high thermal dissipation requirements.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of sealed packaging with 0% water absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve copper weights up to 800 micrometers on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Sports Vehicles, Aerospace, and more.
