Direct Electroplated Metalized Substrate (DPC)
DPC (Direct Plating Copper) is a magnetic sputtering-coated base material, based on electroplating technology, achieving metallization of ceramic surfaces and enabling thermoelectric separation.
Advantages
1. Higher thermal conductivity and a more matched coefficient of thermal expansion.
2. Stronger, lower resistance metal film layer.
3. Excellent weldability and high operating temperature.
4. Excellent insulation properties.
5. Customized conductive layer thickness within 0.1mm to 1mm.
6. Free of organic components, resistant to cosmic rays, highly reliable in aerospace applications, and boasts a long service life.
7. High-density assembly line/spacing (L/S) resolution up to 20um, enabling the miniaturization and integration of equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Electroplated copper sealing holes, high reliability.
10. 3D Substrate, 3D Wiring.
Application Fields: Automotive Electronics, Industrial Control Electronics, Communication Industry, LED Packaging, Gesture Recognition, Face Recognition, TEC Refrigeration, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LEDs, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Cameras, Vehicle LED, UV LED
Technical Capabilities
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Copper-clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material made by bonding copper foil directly onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulation properties.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycle performance with up to 50,000 cycles, ensuring high reliability.
5. Structures that can be etched with various patterns, just like PCB boards (or IMS substrates).
6. Pollution-free and non-hazardous.
7. Operating temperature range wide: -55℃ to 850℃; thermal expansion coefficient close to silicon, simplifying the production process of power modules.
Application Areas: The applications of DBC ceramic substrates are extensive. They are used in semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, and intelligent power components, as well as high-frequency applications.
DBC ceramic substrates are present in various industrial electronics fields, including switch power supplies, solid-state relays, automotive electronics, solar panel components, telecommunications-specific switches, receiving systems, and lasers.
Technical Capabilities
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Copper-clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes active metal elements in solder (such as Ti/Ag/Zr/Cu) to bond ceramics with metals, creating a reaction layer of ceramics that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between ceramics and active metal solder paste at high temperatures, resulting in higher bonding strength and better reliability, making them suitable for connectors or applications requiring high current carrying capacity and thermal dissipation.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of sealed packaging with 0% moisture absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve up to 800 micrometers of copper weight on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Motorcycles, Aerospace, and more.
