Direct Electroplating Metalized Substrate (DPC)
DPC (Direct plating copper) is a fundamental electronic material achieved through magnetic sputtering pre-plating and electroplating processes, enabling metallization of ceramic surfaces and thermal-electric separation.
Advantages
1. Higher thermal conductivity, a more matched coefficient of thermal expansion.
2. Stronger, lower resistance metal film layer.
3. Excellent weldability and high operating temperature.
4. Good insulation properties.
5. Customizable conductive layer thickness within the range of lum to 1mm.
6. Free of organic components, highly resistant to cosmic rays, offering high reliability in aerospace applications with a long service life.
7. High-density assembly line/spacing (L/S) resolution up to 20um, enabling integrated miniaturization of the equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Electroplated copper sealing holes, high reliability.
10. 3D Substrate, 3D Wiring.
Application Fields: Automotive Electronics, Industrial Electrical Control, Communication Industry, LED Packaging, Gesture Recognition, Face Recognition, TEC Cooling, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LED, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Camera, Automotive LED, UV LED
Technical Capabilities
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Copper-clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material manufactured by bonding copper foil directly onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulation properties.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycle performance with up to 50,000 cycles, ensuring high reliability.
5. Structures that can be etched with various patterns, just like PCB boards (or IMS substrates).
6. Non-polluting and harmless.
7. Operating temperature range: -55℃ to 850℃; coefficient of thermal expansion similar to silicon, simplifying the production process for power modules.
Application Areas: The downstream applications of DBC ceramic substrates are extensive. They are used in semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, and intelligent power components, as well as high-frequency circuits.
DBS ceramic substrates are featured in various industrial electronic fields, including switch power supplies, solid-state relays, automotive electronics, solar panel components, telecommunication-specific switches, receiving systems, and lasers.
Technical Capabilities
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Copper-clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes active metal elements in solder (such as Ti/Ag/Zr/Cu) to bond ceramics with metals, forming a reaction layer on the ceramic that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between the ceramic and the active metal solder paste at high temperatures, resulting in higher bonding strength and better reliability. They are suitable for connectors or applications requiring high current carrying capacity and excellent heat dissipation.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of sealed packaging with 0% water absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve up to 800 micrometers of copper weight on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Motorcycles, Aerospace, and other sectors.
