Direct Electroplated Metalized Substrate (DPC)
DPC (Direct Plating Copper) is a foundational electronic material, achieved through magnetic sputtering pre-plating and electroplating processes, which achieves metalization of ceramic surfaces and enables thermal and electrical separation.
Advantages
1. Higher thermal conductivity, more compatible thermal expansion coefficient.
2. Stronger and lower resistance metallic film coating.
Good weldability and high operating temperature.
4. Excellent insulation properties.
5. Customizable conductive layer thickness within the range of lum to 1mm.
6. Free from organic components, with resistance to cosmic rays, high reliability in aerospace applications, and long service life.
7. Capable of high-density assembly lines/spacing (L/S) resolution up to 20um, thereby achieving device integration and miniaturization.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Copper-plated sealed holes, high reliability.
10. Three-dimensional substrates, three-dimensional wiring.
Application Fields: Automotive Electronics, Industrial Control Electronics, Communication Industry, LED Packaging, Gesture Recognition, Facial Recognition, TEC Refrigeration, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LED, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Camera, Automotive LED, UV LED
Technical Capabilities
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Copper Clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material manufactured by bonding copper foil directly onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulation properties.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycle performance with up to 50,000 cycles, ensuring high reliability.
5. Structures that can be etched with various patterns, similar to PCB boards (or IMS substrates).
6. Non-toxic and free of environmental hazards.
7. Wide operating temperature range: -55℃ to 850℃; coefficient of thermal expansion similar to silicon, simplifying the production process of power modules.
Application Areas: The downstream applications of DBC ceramic substrates are extensive, including semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, and smart power components, as well as high-frequency applications.
DBS ceramic substrates are found in a variety of industrial electronics fields, including switch power supplies, solid-state relays, automotive electronics, solar panel components, telecommunication switches, receiving systems, and lasers.
Technical Capabilities
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Copper-clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes active metal elements in solder (such as Ti/Ag/Zr/Cu) to bond ceramics with metals, forming a reactive layer on the ceramic that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between the ceramic and the active metal solder paste at high temperatures, resulting in higher bonding strength and better reliability. They are suitable for connectors or applications requiring high current carrying capacity and excellent heat dissipation.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
The possibility of a sealed packaging with 0% water absorption rate.
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve up to 800 micrometers of copper weight on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Sports, Aerospace, and more.
