Direct Electroplated Metalized Substrate (DPC)
DPC (Direct Plating Copper) is a foundational electronic material achieved through a sputtering pre-plating process, based on electroplating technology, for metalizing ceramic surfaces and facilitating thermoelectric separation.
Advantages
1. Higher thermal conductivity, a more matched coefficient of thermal expansion.
2. Stronger, lower resistance metal film layer.
3. Excellent weldability and high operating temperature.
4. Excellent insulation properties.
5. Customizable conductive layer thickness within 0.1mm to 1mm.
6. Free of organic content, resistant to cosmic rays, highly reliable in aerospace applications, and boasts a long service life.
7. High-density assembly line/spacing (L/S) resolution up to 20um, enabling integrated miniaturization of equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Copper-plated sealed holes, high reliability.
10. 3D Substrate, 3D Wiring.
Application Fields: Automotive Electronics, Industrial Electrical Control, Communication Industry, LED Packaging, Gesture Recognition, Face Recognition, TEC Refrigeration, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LED, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Cameras, Vehicle LED, UV LED
Technical Capabilities
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Copper Clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material made by bonding copper foil directly onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. Strong mechanical stress, stable shape.
2. High strength, high thermal conductivity, and high insulating properties.
3. Strong adhesion, corrosion-resistant.
4. Features excellent thermal cycling performance, with a cycle life of up to 50,000 cycles and high reliability.
5. Structures that can be etched into various patterns, like PCB boards (or IMS substrates).
6. Non-polluting and harmless.
7. Wide operating temperature range of -55℃ to 850℃; thermal expansion coefficient close to silicon, simplifying the production process of power modules.
Application Areas: The downstream applications of DBC ceramic substrates are extensive, including semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, intelligent power components, high-frequency
DBS ceramic substrates are featured in various industrial electronic fields, including switching power supplies, solid-state relays, automotive electronics, solar panel components, telecommunication-specific switches, receiving systems, and lasers.
Technical Capabilities
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Copper Clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes the reactive metal elements in solder (such as Ti/Ag/Zr/Cu) to bond ceramics with metals, forming a reaction layer on the ceramic that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between the ceramic and reactive metal solder paste at high temperatures, resulting in higher bonding strength and better reliability. They are suitable for connectors or applications requiring high current carrying capacity and heat dissipation.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of a sealed packaging with 0% water absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve up to 800 micrometers of copper weight on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Sports Vehicles, Aerospace, and more.
