Direct Electroplated Metalized Substrate (DPC)
DPC (Direct Plating Copper) is a foundational electronic material that achieves metalization on ceramic surfaces through magnetron sputtering, based on electroplating technology, and facilitates thermoelectric separation.
Advantages
1. Higher thermal conductivity, a more compatible coefficient of thermal expansion.
2. Stronger, lower resistance metal film layer.
3. Good weldability and high operating temperature.
4. Excellent insulation properties.
5. Customizable conductive layer thickness within the range of lum to 1mm.
6. Non-organic content, resistant to cosmic rays, high reliability in aerospace applications, and long service life.
7. Capable of high-density assembly line/spacing (L/S) resolution down to 20um, thereby achieving integrated miniaturization of the equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Electroplated copper sealing, high reliability.
10. 3D Substrate, 3D Wiring.
Application Fields: Automotive Electronics, Industrial Control Electronics, Communication Industry, LED Packaging, Gesture Recognition, Face Recognition, TEC Cooling, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LED, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Camera, Vehicle LED, UV LED.
Technical Capabilities
Product Images
Copper Clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material manufactured by bonding copper foil directly to the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulation.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycle performance with up to 50,000 cycles, high reliability.
5. Structures that can be etched into various patterns, similar to PCB boards (or IMS substrates).
6. Non-toxic and pollution-free.
7. Operating temperature range wide from -55℃ to 850℃; thermal expansion coefficient close to silicon, simplifying the production process of power modules.
Application Fields: The applications of DBC ceramic substrates are extensive in the downstream market. They are used in semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, and intelligent power components, as well as high-frequency applications.
DBC ceramic substrates are featured in multiple industrial electronic fields including switch power supplies, solid-state relays, automotive electronics, solar panel components, telecommunications-specific switches, receiving systems, and lasers.
Technical Capabilities
Product Images
Copper-clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that achieves the bonding of ceramics to metals by utilizing active metal elements in the solder (such as Ti/Ag/Zr/Cu). The ceramic forms a reactive layer that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates bond through a chemical reaction between the ceramic and active metal solder paste at high temperatures, resulting in higher bonding strength and better reliability, making them suitable for connectors or applications with high current carrying capacity and high thermal dissipation requirements.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of a sealed packaging with 0% water absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve copper weights up to 800 micrometers on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Sports Vehicles, Aerospace, and more.
