Direct Electroplated Metalized Substrate (DPC)
DPC (Direct plating copper) is a foundational electronic material that achieves metalization on ceramic surfaces via magnetron sputtering, based on electroplating technology, and facilitates thermal and electrical separation.
Advantages
1. Higher thermal conductivity, a more matched coefficient of thermal expansion.
2. Stronger, lower resistance metal film layer.
3. Excellent weldability and high operating temperature.
4. Excellent insulation properties.
5. Conductive layer thickness customizable within 0.1mm to 1mm.
6. Free of organic content, resistant to cosmic rays, highly reliable in aerospace applications, and boasts a long service life.
7. High-density assembly line/spacing (L/S) resolution up to 20um, enabling integrated miniaturization of equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Copper plated sealed holes, high reliability.
10. Three-dimensional Substrates, Three-dimensional Wiring.
Application Fields: Automotive Electronics, Industrial Control Electronics, Communication Industry, LED Packaging, Gesture Recognition, Facial Recognition, TEC Refrigeration, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LED, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Camera, Automotive LED, UV LED
Technical Capabilities
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Copper Clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material made by directly sintering copper foil onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulation properties.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycle performance with up to 50,000 cycles, ensuring high reliability.
5. Structures that can be etched into various patterns, just like PCB boards (or IMS substrates).
6. Non-polluting and harmless.
7. Wide operating temperature range of -55℃ to 850℃; thermal expansion coefficient close to silicon, simplifying the production process of power modules.
Application Fields: The downstream applications of DBC ceramic substrates are extensive, including semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, and intelligent power components, as well as high-frequency applications.
DBC ceramic substrates are featured in various industrial electronic fields, including switch power supplies, solid-state relays, automotive electronics, solar panel components, telecommunication dedicated switches, receiving systems, and lasers.
Technical Capabilities
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Copper-clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes active metal elements in solder (such as Ti/Ag/Zr/Cu) to bond ceramics with metals, forming a reaction layer on the ceramic that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between the ceramic and active metal solder paste at high temperatures, resulting in higher bonding strength and better reliability. They are suitable for connectors or applications requiring high current carrying capacity and excellent heat dissipation.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of a sealed packaging with 0% water absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve up to 800 micrometers of copper weight on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Sports Vehicles, Aerospace, and more.
