Direct Electroplating Metalized Substrate (DPC)
DPC (Direct plating copper) is a fundamental electronic material achieved through magnetic sputtering pre-coating and electroplating, enabling metallization of ceramic surfaces for thermal and electrical separation.
Advantages
1. Higher thermal conductivity, a more matched coefficient of thermal expansion.
2. Stronger, lower resistance metal film layer.
Good weldability with high operating temperature.
4. Excellent insulation properties.
5. Customizable conductive layer thickness within 0.1mm to 1mm.
6. Free from organic components, highly resistant to cosmic radiation, offering high reliability and long service life in aerospace applications.
7. Capable of high-density assembly line/spacing (L/S) resolution down to 20um, achieving integration and miniaturization of equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Copper-plated sealed holes, high reliability.
10. 3D Substrates, 3D Wiring.
Application Fields: Automotive Electronics, Industrial Control Electronics, Communication Industry, LED Packaging, Gesture Recognition, Facial Recognition, TEC Refrigeration, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LED, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Camera, Vehicle LED, UV LED
Technical Capabilities
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Copper Clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material made by directly fusing copper foil onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulation.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycling performance with up to 50,000 cycles, high reliability.
5. Structures that can be etched with various patterns, just like PCB boards (or IMS substrates).
6. Non-polluting and free of hazards.
7. Wide operating temperature range of -55℃ to 850℃; thermal expansion coefficient close to silicon, simplifying the production process of power modules.
Application Areas: The application of DBC ceramic substrates is widespread in downstream fields. It includes semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, intelligent power components, high-frequency
Switching power supplies, solid-state relays, automotive electronics, solar panel components, telecommunication-specific switches, receiving systems, and laser, among many other industrial electronic fields, all feature DBC ceramic substrates.
Technical Capabilities
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Copper-clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes the reactive metal elements in solder (such as Ti/Ag/Zr/Cu) to bond ceramics with metals, forming a reaction layer of ceramics that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between ceramics and reactive metal solder paste at high temperatures, resulting in higher bonding strength and better reliability, making them suitable for connectors or applications with high current carrying capacity and high thermal dissipation requirements.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of a sealed packaging with 0% water absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve a copper weight of up to 800 micrometers on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Sports Vehicles, Aerospace, and more.
