Ceramic laser cutting, drilling, and slicing services for various oxide ceramics, refractory ceramics, including alumina, zirconia, glass oxide, silicon nitride, silicon carbide, aluminum nitride, and other ceramic materials. Also suitable for cutting and slicing various types of silicon wafers.

Local irradiation of ceramic substrates or metal thin plates causes the surface material to rapidly vaporize and peel off in an extremely short time, thereby achieving material removal for cutting and drilling purposes.

Key Features of Ceramic Laser Cutting (1) Good cutting quality: Due to the small laser spot, high energy density, and fast cutting speed, excellent cutting quality is achieved. ① Narrow cut lines: The laser cut lines are generally 0.10～0.20mm wide, saving material. ② Good perpendicularity of cut edges: The cutting surface is smooth with no burrs, and the surface roughness is typically controlled at Ra:12.5 or above. ③ Small heat-affected zone: The laser processing results in fine cut lines, high speed, and concentrated energy, leading to minimal heat transferred to the material, causing very little deformation. In some cases, the heat-affected zone width is below 0.05mm.

In material processing, a brand new method has gradually emerged - laser processing, which is now applied in cutting, drilling, and welding, among other fields. Laser cutting, in particular, is suitable for hard and brittle materials like ceramics and glass, as it imposes minimal mechanical impact and pressure on the materials being cut. Shenzhen Kebao Yuan Technology's electronic ceramic laser cutting achieves satisfactory results in ceramic processing, maintaining the hardness of the raw materials without reduction and forming a special hardening layer on the cutting edge that is harder than the base material.