Direct Electroplated Metalized Substrate (DPC)
DPC (Direct Plating Copper) is a foundational electronic material, achieved through magnetic sputtering pre-plating and electroplating processes, which achieves metallization on ceramic surfaces and facilitates thermal and electrical separation.
Advantages
Higher thermal conductivity, more matched coefficient of thermal expansion.
2. Stronger, lower resistance metal film layer.
3. Excellent weldability and high operating temperature.
4. Good insulation properties.
5. Conductive layer thickness is customizable within the range of lum to 1mm.
6. Non-organic content, resistant to cosmic rays, high reliability in aerospace applications, and long service life.
7. High-density assembly line/spacing (L/S) resolution up to 20um, enabling the miniaturization and integration of equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Copper plated sealed holes, high reliability.
10. Three-dimensional Substrate, Three-dimensional Wiring.
Application Fields: Automotive Electronics, Industrial Control Electronics, Communication Industry, LED Packaging, Gesture Recognition, Facial Recognition, TEC Cooling, MEMS Packaging, RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LEDs, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Cameras, Vehicle LED, UV LED
Technical Capabilities
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Copper-clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material manufactured by directly sintering copper foil onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulating properties.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycling performance with up to 50,000 cycles, ensuring high reliability.
5. Structures that can be etched with various patterns, just like PCB boards (or IMS substrates).
6. Non-polluting and non-harmful.
7. Operating temperature range: -55℃ to 850℃; coefficient of thermal expansion similar to silicon, simplifying the production process of power modules.
Application Fields: The applications of DBC ceramic substrates are extensive in downstream fields, including semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, and intelligent power components, as well as high-frequency applications.
DBC ceramic substrates are found in various industrial electronics fields, including switch power supplies, solid-state relays, automotive electronics, solar panel components, telecommunication-specific switches, receiving systems, and lasers.
Technical Capabilities
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Copper-clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that uses active metal elements in the solder (such as Ti/Ag/Zr/Cu) to bond ceramics with metal, creating a reaction layer of ceramics that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between the ceramic and active metal solder paste at high temperatures, resulting in higher bonding strength and better reliability, making them suitable for connectors or applications requiring high current carrying capacity and thermal dissipation.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of sealed packaging with 0% water absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve up to 800 micrometers of copper weight on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Sports Vehicles, Aerospace, and more.
