Direct Electroplated Metalized Substrate (DPC)
DPC (Direct Plating Copper) is a fundamental electronic material that achieves metallization on ceramic surfaces through magnetic sputtering priming, based on electroplating technology, enabling thermal and electrical separation.
Advantages
Higher thermal conductivity, more matched coefficient of thermal expansion.
2. Stronger, lower resistance metal film layer.
3. Excellent weldability and high operating temperature.
4. Good insulation properties.
5. Conductive layer thickness is customizable within the range of lum to 1mm.
6. Free of organic content, resistant to cosmic rays, highly reliable in aerospace applications, and boasts a long service life.
7. High-density assembly line/spacing (L/S) resolution up to 20um, enabling integration and miniaturization of equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Copper-plated sealed holes, high reliability.
10. 3D Substrate, 3D Wiring.
Application Fields: Automotive Electronics, Industrial Control Electronics, Communication Industry, LED Packaging, Gesture Recognition, Facial Recognition, TEC Cooling, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LEDs, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Cameras, Vehicle LED, UV LED
Technical Capabilities
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Copper Clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material made by directly fusing copper foil onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulating properties.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycle performance, with up to 50,000 cycles, ensuring high reliability.
5. Structures that can be etched with various patterns, just like PCB boards (or IMS substrates).
6. Pollution-free and harmless.
7. Wide operating temperature range of -55℃ to 850℃; coefficient of thermal expansion similar to silicon, simplifying the production process of power modules.
Application Areas: The applications of DBC ceramic substrates are extensive. They are used in semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, intelligent power components, and high-frequency circuits.
DBS ceramic substrates are present in various industrial electronic fields, including switch power supplies, solid-state relays, automotive electronics, solar panel components, telecommunication-specific switches, receiving systems, and lasers.
Technical Capabilities
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Copper-clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes active metal elements in solder (such as Ti/Ag/Zr/Cu) to bond ceramics to metals. It forms a reaction layer on the ceramic that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between the ceramic and the active metal solder paste at high temperatures. This results in higher bonding strength and better reliability, making them suitable for connectors or applications requiring high current carrying capacity and heat dissipation.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of seal packaging with 0% water absorption rate
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve up to 800 micrometers of copper weight on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Sports Vehicles, Aerospace, and more.
