Direct Electroplated Metalized Substrate (DPC)
DPC (Direct Plating Copper) is a foundational electronic material that achieves metallization on ceramic surfaces through magnetic sputter coating, based on electroplating technology, and facilitates thermal and electrical separation.
Advantages
1. Higher thermal conductivity, a more suitable coefficient of thermal expansion.
2. Stronger and lower resistance metal film layer.
3. Excellent weldability and high operating temperature.
4. Excellent insulation properties.
5. Customized conductive layer thickness within the range of lum to 1mm.
6. Free of organic content, resistant to cosmic rays, highly reliable in aerospace applications, with a long service life.
7. Capable of high-density assembly lines/spacing (L/S) resolution up to 20um, achieving integrated miniaturization of equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Electroplated copper sealed holes, high reliability.
10. Three-dimensional substrates, three-dimensional wiring.
Application Fields: Automotive Electronics, Industrial Electrical Control, Communication Industry, LED Packaging, Gesture Recognition, Facial Recognition, TEC Refrigeration, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LED, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Cameras, Vehicle LED, UV LED
Technical Proficiency
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Copper Clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material produced by directly sintering copper foil onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. Strong mechanical stress, stable shape.
2. High strength, high thermal conductivity, and high insulation.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycle performance with up to 50,000 cycles, high reliability.
5. Structures that can be etched with various patterns, similar to PCB boards (or IMS substrates).
6. Non-polluting and harmless.
7. Operating temperature range: -55℃ to 850℃; coefficient of thermal expansion close to silicon, simplifying the production process of power modules.
Application Areas: The applications of DBC ceramic substrates are extensive. They are used in semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, and intelligent power components, as well as high-frequency applications.
Switching power supplies, solid-state relays, automotive electronics, solar panel components, telecommunication-specific switches, receiving systems, and lasers are among the many industrial electronic fields where DBC ceramic substrates are present.
Technical Capabilities
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Copper Clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes active metal elements in solder (such as Ti/Ag/Zr/Cu) to bond ceramics with metals, forming a reaction layer on the ceramic that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between the ceramic and active metal solder paste at high temperatures, resulting in higher bonding strength and better reliability. They are suitable for connectors or applications requiring high current carrying capacity and excellent heat dissipation.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of a sealed packaging with 0% water absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve up to 800 micrometers of copper weight on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Sports Vehicles, Aerospace, and more.
