Direct Electroplated Metalized Substrate (DPC)
DPC (Direct Plating Copper) is a foundational electronic material achieved through magnetic sputtering pre-plating and electroplating processes, enabling metalization of ceramic surfaces and thermal-electrical separation.
Advantages
Higher thermal conductivity, more matching coefficient of thermal expansion.
2. Stronger and lower resistance metal film layer.
3. Excellent weldability and high operating temperature.
4. Excellent insulation properties.
5. Customizable conductive layer thickness within the range of lum to 1mm.
6. Non-organic composition, resistant to cosmic radiation, high reliability in aerospace applications, and long service life.
7. High-density assembly line/spacing (L/S) resolution up to 20um, enabling integrated miniaturization of equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Electroplated copper sealing, high reliability.
10. Three-dimensional substrates, three-dimensional wiring.
Application Fields: Automotive Electronics, Industrial Control Electronics, Communication Industry, LED Packaging, Gesture Recognition, Facial Recognition, TEC Refrigeration, MEMS Packaging, RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LED, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Camera, Automotive LED, UV LED
Technical Capabilities
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Copper Clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material made by directly fusing copper foil onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulation properties.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycle performance with up to 50,000 cycles, high reliability.
5. Structures that can be etched with various patterns, similar to PCB boards (or IMS substrates).
6. Non-polluting and non-harmful.
7. Operating temperature range: -55℃ to 850℃; coefficient of thermal expansion similar to silicon, simplifying the production process of power modules.
Application Fields: The application downstream of DBC ceramic substrates is extensive. In semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, intelligent power components, high-frequency
DBS ceramic substrates are found in a multitude of industrial electronic fields, including switch mode power supplies, solid state relays, automotive electronics, solar panel components, telecommunication-specific switches, receiving systems, and laser technology.
Technical Capabilities
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Copper Clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes active metal elements in solder (such as Ti/Ag/Zr/Cu) to bond ceramics to metals, forming a reaction layer that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between ceramics and active metal solder paste at high temperatures, resulting in higher bonding strength and better reliability. They are suitable for connectors or applications that require high current carrying capacity and excellent thermal dissipation.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of a sealed packaging with 0% water absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve copper weights up to 800 micrometers on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Motorcycles, Aerospace, and more.
