Direct Electroplated Metalized Substrate (DPC)
DPC (Direct Plating Copper) is a basic electronic material that achieves metallization on ceramic surfaces through magnetic sputter coating, based on electroplating technology, and enables thermal and electrical separation.
Advantages
1. Enhanced thermal conductivity, a more matched coefficient of thermal expansion.
2. Stronger and lower resistance metal film layer.
3. Excellent weldability and high operating temperature.
4. Excellent insulation properties.
5. Customizable conductive layer thickness within the range of lum to 1mm.
6. Free of organic content, resistant to cosmic rays, with high reliability in aerospace applications and long service life.
7. Capable of high-density assembly line/spacing (L/S) resolution down to 20um, enabling integrated miniaturization of the equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Electroplated copper sealed holes, high reliability.
10. 3D Substrate, 3D Wiring.
Application Fields: Automotive Electronics, Industrial Electric Control, Communication Industry, LED Packaging, Gesture Recognition, Face Recognition, TEC Refrigeration, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LEDs, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Cameras, Vehicle LED, UV LED
Technical Capabilities
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Copper-clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as a copper-clad ceramic substrate, is an electronic base material made by directly sintering copper foil onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulation properties.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycle performance with up to 50,000 cycles, high reliability.
5. Structures that can be etched with various patterns, similar to PCB boards (or IMS substrates).
6. Non-polluting and free from hazards.
7. Operating temperature range: -55℃ to 850℃; thermal expansion coefficient close to silicon, simplifying the production process of power modules.
Application Fields: The applications of DBC ceramic substrates are extensive in the downstream market. They are used in semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, intelligent power components, high-frequency
DBS ceramic substrates are featured in various industrial electronic fields, including switch power supplies, solid-state relays, automotive electronics, solar panel components, telecommunication-specific switches, receiving systems, and lasers.
Technical Capabilities
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Copper Clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes the reactive metal elements in the solder (such as Ti/Ag/Zr/Cu) to bond ceramics with metals, forming a reaction layer on the ceramic that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between the ceramic and reactive metal solder paste at high temperatures, resulting in higher bonding strength and better reliability. They are suitable for connectors or applications requiring high current carrying capacity and heat dissipation.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of a sealed packaging with 0% moisture absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve up to 800 micrometers of copper weight on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Sports Vehicles, Aerospace, and more.
