Epoxy resin boardEpoxy phenolic boards, produced by our manufacturer, are made from epoxy resin, phenolic resin, and glass fiber fabric, through bonding and high-temperature hot pressing. They offer advantages such as high temperature resistance, corrosion resistance, high strength, and good toughness. Mainly used for manufacturing switches, transformers, circuit board substrates, etc. These boards are created by impregnating electrical glass fabric with epoxy resin, followed by drying and hot pressing. The board surface is free of bubbles, pits, and wrinkles. They possess excellent mechanical properties, outstanding mechanical performance at moderate temperatures, arc resistance, and a variety of specifications.
Technical Features of Epoxy Phenolic Board:
Vertical plane bending strength (as received): E-1/150, 150±5℃ ≥ 340 MPa
      Parallel layer impact strength (simply supported beam method): ≥230 KJ/m
After immersion, insulation resistance (D-24/23): ≥5.0×10^8 Ω
Vertical layer electrical strength (in transformer oil at 90±2℃, 1mm plate thickness): ≥14.2 MV/m
Parallel layer breakdown voltage (in transformer oil at 90±2℃): ≥40KV
Relative Dielectric Constant (50Hz): ≤5.5
Relative Dielectric Constant (1MHz): ≤5.5
Medium Loss Factor (50Hz): ≤0.04
Medium Loss Factor (1MHz): ≤0.04
Water Absorption (D-24/23, 1.6mm board thickness): ≤19mg