The IPS3000 is a high-performance automated burning machine with dual nozzles launched by Angco, capable of accommodating up to 4 powerful Angco burning cores, the AP8000. The system can be expanded to support up to 32 burning stations, providing clients with efficient and cost-effective production capacity utilization.

● Anco's highly trusted IPS automatic mechanism frame guarantees stable and reliable performance throughout the entire lifespan of the machine

● Newly designed dual-nozzle chip pick-and-place system, achieving high-speed and efficiency (UPH 2500) while ensuring precision in pick-and-place and ultra-quiet operation

System supports various small-size package programming.

● Integration with MES Manufacturing Execution System ensures full control and traceability of the production process

Featured Features

High-output General-purpose Burner AP8000

● Built-in with 4 recording machines and 32 recording stations

Up to 2,500 UPH (Units Per Hour)

● Supported IC Types: UFS, eMMC, Nor/Nand Flash, EEPROM, CPLD, FPGA, Anti-Fuse, and other customer-customized chips/modules

Support various IC packaging styles

Intelligent Image System

● Two bottom cameras (1.3MP) with IC synchronized skew correction, and one top camera (1.3MP) for positioning at various work stations (including trays, material belts, burn-in seats, etc.).

● Fully automatic IC outline positioning, eliminates traditional membrane board matching, making operation easier and more intuitive

High-precision identification of small chips, supporting 2X2mm chip packaging

● Precision IC handling, ensuring stable chip pick-and-place and high yield

High output, high reliability

● Four-nozzle high-precision IC Pick&Place component

● UPH up to 2500

● Automated real-time material stacking detection

Automatic Infeed and Outfeed Trays (AutoTray System)

● Efficient automatic tray system; loading and unloading do not affect UPH

● The automatic tray system is simple and reliable, enhancing system stability.

Automatic Coiling Equipment (Tape Out)

● Simultaneously supports cold and hot seal packaging

● Supports tape widths from 8 to 32mm

High precision stepping (±0.04 mm) feeding

Ink Drop Mechanism & Inkjet Printer

Optional semiconductor-specific dotting ink unit and inkjet printing device

● Supports automatic rewind and automatic tray device marking

✓ Supports dot and character printing

✔ Available in various colors

✓ Ink meets RoHS requirements

Product Specifications Sheet